Active China Xpeedic
Introduction
Advanced package design tool from Xpeedic, focusing on design and verification of complex packaging technologies such as SiP and Chiplet. Supports multi-layer stackup design, co-simulation, and full-process collaborative design from chip to package, helping engineers efficiently solve signal and power integrity issues in high-frequency and high-speed packaging.
Features
- SiP & Chiplet package design
- Multi-layer stackup & co-design
- Chip-to-package full-process collaboration
- High-frequency & high-speed signal integrity analysis
- Power integrity verification
- Powerful 3D modeling & viewing