Discontinued China Xpeedic
Introduction
Hermes 3D is an advanced 3D electromagnetic simulation platform launched by Xpeedic. It focuses on electromagnetic characteristic analysis of high-speed interconnect structures, supporting full-chain simulation from chip to board level. With powerful modeling capabilities and an efficient solver, it is suitable for complex System-in-Package (SiP) designs.
Features
- Advanced 3D EM simulation
- Chip-to-board full chain
- Efficient solving algorithms
- Suitable for SiP design
- Powerful geometric modeling
- Improves high-speed interconnects