OpenCE

Introduction

OpenCE is an engineering toolchain for physical AI, made of two desktop apps from the same team, Layer and Core, sharing one project. Layer turns a sentence into a manufacturable PCB: testable numbered requirements, real in-stock parts, schematic, placement and routing, each gated by a check, delivered as a native KiCad project plus Gerber, drill, pick-and-place, BOM, IPC-2581, STEP, a review pack and a bring-up plan. Core takes that board, writes the firmware, flashes it with your approval and gives a verdict from real hardware. Every step that touches copper or a chip waits for your approval, and design and manufacturability checks never cost extra on any plan.

Features

• Layer turns a sentence into testable numbered requirements with assumptions and open questions
• Picks real in-stock parts with live stock, price breaks, lifecycle and verified symbols, footprints and 3D models
• Generates architecture, schematic, placement and routing, each gated by a check
• Delivers a native KiCad project plus Gerber, drill, pick-and-place, BOM, IPC-2581, STEP, a review pack and a bring-up plan
• Two-layer boards are supported end to end today; four-layer is in development, six and eight layer with BGA escape to follow
• Boards beyond the current limit are refused in writing rather than silently simplified
• Core reads the schematic, writes firmware, flashes after your approval and proves it on the target
• Supports ESP32, STM32, nRF, RP2040/RP2350, Teensy, Arduino, Seeed and Linux boards such as Raspberry Pi and Jetson
• Works with OpenAI, Anthropic, Gemini, Azure or local models, with keys kept in the OS keychain
• Projects stay local and designs are never used for training; Enterprise adds air-gapped deployment and audit export