Active China RedEDA
Introduction
RedPKG is a constraint rule-driven IC package design tool designed to efficiently handle complex package design needs and adapt to domestic industry scenarios. It is fully compatible with various package configurations and mainstream substrate technologies.
Features
- Supports wire bonding/flip chip/stacked chip package configurations
- Supports laminate/ceramic/silicon-based mainstream substrate technologies
- Built-in 3D visualization and DRC full-process inspection
- Supports HDI high-density interconnect design and multi-user concurrent editing
- Integrated DFM and ARC full-process compliance modules
- Independent signal/power integrity analysis and thermal simulation
- Supports RLGC parameter extraction/IR drop analysis and electro-thermal co-verification
- Supports Gerber/IPC2581 and other mainstream manufacturing output formats
- Cross-platform compatible with Windows/Linux and domestic Kylin OS