RedSIM
www.rededa.com/redsim-autoActive China RedEDA
Introduction
RedSIM is an automated simulation platform for package PCB under the RedEDA platform of RedEDA, facing the fields of semiconductor advanced packaging, PCB and system design, relying on the RedEDA technology base to achieve full simulation process automation.
Features
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- Supports high-speed SI/EMI/thermal/structural fatigue analysis and other full-link requirements
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- Supports simulation and test data comparison/project cross-comparison and trend curve construction
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- Automated process reduces newcomer learning costs