RedSIM

Introduction

RedSIM is an automated simulation platform for package PCB under the RedEDA platform of RedEDA, facing the fields of semiconductor advanced packaging, PCB and system design, relying on the RedEDA technology base to achieve full simulation process automation.

Features

• Full-process automation for modeling, mesh generation, solving processing and report generation
• Standardized process with solidified simulation process and parameter specifications
• Multi-scenario full coverage with electro-thermal-mechanical multi-physics simulation at package, PCB, system level
• Supports high-speed SI, EMI, thermal, structural fatigue analysis and other full-link requirements
• Unified data management with unified simulation database
• Supports simulation and test data comparison, project cross-comparison and trend curve construction
• Collaboration and low threshold with project review, customer docking and supplier collaboration interface
• Automated process reduces newcomer learning costs